top of page

Xavis Semiconductor XSCAN 9860 Series
Xray System

ArrowBlueRight
ArrowBlueLeft
SC-Xavis XSCAN 9860 X-ray System for Semiconductor Applications

2D/3D Hybrid Inspection System with Automation Technology.

​

Precise results using high-speed OCT technology.

​

Built for user convenience

​

S/W, Table Size, etc. can be customized according to users and applications.

​

Applications:

Flip chip, Memory, LSI bump, Wafer bump, etc

Features

  • In-line Bump Detection by Automatic Inspection Algorithm

  • High-Speed Oblique Computed Tomography Technology

  • 60° Oblique Angle & 360° Rotation

  • Open micro focus tube with transmission target

  • Tube Voltage Range: 10~ 160kV

  • Current Range: 50 ~ 1000μA

  • Max. Tube power: 80W

  • Max. Target power: 10W

  • Min.Detectablility: 0.25μm

  • 160kV High-Tension Generator

Xavis XSCAN 9860 Flip ChipWire
Xavis XSCAN 9860 Inspection Image
Xavis XSCAN 9860 Spec Sheet
bottom of page