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Xavis Semiconductor XSCAN H Series
Xray System

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SC-Xavis-XSCAN-H Series X-ray System for Semiconductor Applications

2D/3D Hybrid Inspection System with Automation Technology

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Precise results using high-speed OCT technology

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Built for user convenience

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S/W, Table Size, etc. can be customized according to users and applications.

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Applications:​

PCB, PCBA / MLB, Ultra precision inspection
μBGA, BGA, CSP, ACF, Flip-Chip, FPCB, etc. 
Semiconductor, various selected printing functions by
customer-oriented
Engineering plastic injection molding, camera module, etc. 

Features

  • Focus size: 5μm focus closed tube/1um focus open tube

  • Tube power: 130kV (39W), 160kV (10)

  • Detector 60 degree tilt, 5" FPD (Flat Panel Detector)

  • Inspection area: 330mm x 330mm

  • Basic 7 Axis: X1, Y1, X2, Y2, Z, T, R1 (Cone Beam CT 'R2' Axis option)

  • Navigation user interface / Auto teaching

  • Various measuring tool software

  • Easy to use

  • Oblique CT

SC-Xavis-XSCAN-H-InspectionImage
SC-Xavis-XSCAN-H-CT3dImage
SC Xavis XSCAN-H Specs
XscanH
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