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Xavis Semiconductor XSCAN A Series
Xray System

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Xavis-Xscan-A Series X-ray System for Semiconductor Applications

2D/3D Hybrid Inspection System with Automation Technology.

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Precise results using high-speed OCT technology

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Built for user convenience

 

S/W, Table Size, etc. can be customized according to users and applications.

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Applications:​

PCB, PCBA / MLB, Ultra precision inspection.


μBGA, BGA, CSP, ACF, Flip-Chip, FPCB, etc.
 

Semiconductor, various selected printing functions by customer preference.
 

Engineering plastic injection molding, camera module, etc.

Features

  • Focus size: 5μm focus closed type tube

  • Tube power: 100kV (10W, 20W), 130kV (39W), 150kV (75W)

  • High quality resolution 5” FPD (Flat Panel Detector)

  • Detector 50 degree Tilt

  • Inspection area: 500 x 500mm

  • Basic 4 Axis: X,Y, Z, T (Rotation ‘R’ Axis option)

  • Navigation user interface / Auto teaching

  • Various measuring tool software

  • Easy to use

  • Cone beam CT (Option)

Xavis Xscan A spec Sheet
Xavis Xscan A specs
Xavis Semiconductor XSCAN A Spec Sheet
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